Probe card guide plates micro-drilling for semiconductors wafer testing industry

Probe card guide plates in semiconductors wafer test industry faces the challenge of ensuring very high accuracy and stability. With the miniaturization and increasing complexity of integrated circuits, the plates must smoothly guide each probe to its exact test point on the wafer. Any weakness can compromise the test reliability or even harm the device under test (DUT). As wafers evolve with a denser quantity of microchips, the development of advanced probe cards must constantly anticipate this progress. The probe head containing the guide plates must be robust, enduring countless test cycles while retaining its precision.

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Probe cards guide plates micro-drilling application overview

We process any kind of probe card guide plates on a wide range of ceramic materials (Si3N4, Photoveel, etc.). The hole shape is programmable; round, square, rectangle, oblong holes, the possibilities are endless. A very low taper or “zero taper” is required for very fine pitch to avoid hole break-through. Utilizing a process characterized by a high repetition rate and unmatched Laser beam quality, it promises exceptional repeatability in hole quality. This meticulous approach not only delivers unequaled productivity but also ensures a higher yield rate. Critically, the entire process is free from thermal effects (NAZ), safeguarding the integrity of the material at every step.