SACE - Spark Assisted Chemical Engraving SACE – Spark Assisted Chemical Engraving DOWNLOAD [contact-form-7 id=”3971″ title=”Download”] Spark Assisted Chemical Engraving - SACE Mass and flexible production: prototyping small series, batch ‘1 size’.Modular concept with various number of possible configurations: 1 to 4 heads machine configuration.High positioning accuracy and process stability.Clean-room compatible.Mask less process.Low tooling costs.Surface strengthening and texturing.2,5 D machining.Burr and micro-crack free machining. Machining specifications 0.05 to 1.5 mm3/min/tool depending on the quality required.Multitool technology : 1 to 36 tools possible per module Applications Medical industryMicrofluidic devicesMulti layer mixerLab-On-ChipWatch industryWatch dial glassMechanical partsDecoration Electronic industryDrilling for Through Glass Vias (TGV)InterposerOptical PCBMicro Electro Mechanical Systems (MEMS) Quality and expertise Scanning Electron Microscopy (SEM)Rougness measurementsOptical measurements to control shape Micro Machining Hole diameter down to 80 μmGlass transparency property not impactedWithout material deposit and no damages or burrsWall thickness / hole diameter ratio up to 10Smooth and clear machined surfacesNo clean room facilities needed Advanced drilling and routing functions Glass:Pyrex, BF33, D263T, Mempax, AF32, B270Tempered glass:Corning Gorilla, AGC Dragontrail, Schott Xensation, …Quartz:Fused silicaSilicon Specifications Width machining: > 50 µmRatio: up to 1:5 (depending on the design)Thickness: 30 µm up to 4 mmRoughness: Ra > 0,4 µmMachining area: 220 x 220 mmChipping: < 10 µm Related Machines CONTACT US