SACE – Spark Assisted Chemical Engraving
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Spark Assisted Chemical Engraving - SACE
- Mass and flexible production: prototyping small series, batch ‘1 size’.
- Modular concept with various number of possible configurations: 1 to 4 heads machine configuration.
- High positioning accuracy and process stability.
- Clean-room compatible.
- Mask less process.
- Low tooling costs.
- Surface strengthening and texturing.
- 2,5 D machining.
- Burr and micro-crack free machining.
Machining specifications
- 0.05 to 1.5 mm3/min/tool depending on the quality required.
- Multitool technology : 1 to 36 tools possible per module
Applications
- Medical industry
- Microfluidic devices
- Multi layer mixer
- Lab-On-Chip
- Watch industry
- Watch dial glass
- Mechanical parts
- Decoration
- Electronic industry
- Drilling for Through Glass Vias (TGV)
- Interposer
- Optical PCB
- Micro Electro Mechanical Systems (MEMS)
Quality and expertise
- Scanning Electron Microscopy (SEM)
- Rougness measurements
- Optical measurements to control shape
Micro Machining
- Hole diameter down to 80 μm
- Glass transparency property not impacted
- Without material deposit and no damages or burrs
- Wall thickness / hole diameter ratio up to 10
- Smooth and clear machined surfaces
- No clean room facilities needed
Advanced drilling and routing functions
- Glass:
Pyrex, BF33, D263T, Mempax, AF32, B270 - Tempered glass:
Corning Gorilla, AGC Dragontrail, Schott Xensation, … - Quartz:
Fused silica - Silicon
Specifications
- Width machining: > 50 µm
- Ratio: up to 1:5 (depending on the design)
- Thickness: 30 µm up to 4 mm
- Roughness: Ra > 0,4 µm
- Machining area: 220 x 220 mm
- Chipping: < 10 µm
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